Hybricon offers a broad range of products for Communications applications, including backplanes, subracks, powered enclosures and integrated cabinets for both enterprise and central office NEBS applications. As a solutions focused company, we develop customized solutions to meet our customers’ exact requirements. Many examples of these solutions are described in this industry segment of the website.
As an active member of both VITA and PICMG, Hybricon is a leader in developing new industry standards, and Hybricon invests internal R&D to develop new products that comply with the latest industry standards.
Backplane technologies include CompactPCI, and MicroTCA.
Mechanical packaging standards include:
- IEEE 1101.10, IEEE 1101.11 for CompactPCI products
- MicroTCA
Our air cooled products and solutions are available in rack mount form factors.
In communications applications, thermal management has become extremely important. New and emerging technologies, such as MicroTCA, exhibit significantly higher thermal densities, and require engineered thermal solutions. Hybricon has invested significantly in the thermal management area, and is a recognized industry leader in high power applications. To Hybricon, a 100W CompactPCI card is not hot, it’s merely moderately warm. Look further to see examples of some really hot applications.