Press Releases
PICMG 2.18 Serial RapidIO CompactPCI Development Kit
Ayer, MA., October 20, 2004, Hybricon Corporation announces the release of a PICMG 2.18 development chassis that complies with the PICMG 2.18 specification, which was approved and released in June 2004. As the fourth switch fabric to be implemented on CompactPCI®, this is the latest example of the trend for system architectures to move towards serial point-to-point interconnections and switch fabric topologies. The PICMG 2.18 backplane provides a better method of transferring large amounts of data between cards, with an emphasis on real time applications that require low latency. As a sponsor of the PICMG 2.18 subcommittee and as the company chosen by the RapidIO Trade Association to perform all of the signal integrity simulation work for PICMG 2.18, Hybricon is intimately familiar with the PICMG 2.18 specification.
Hybricon's development kit consists of a 9-slot tower with an 8-slot PICMG 2.18 Serial RapidIO CompactPCI® backplane. The backplane is tailored for development lab use with PICMG 2.9 System Management, two PICMG 2.18 fabric slots, and a mix of 2.18 node slots with and without PCI and H.110.
Additional features include:
- Provisions for CD ROM drive, hard drive & floppy drive
- Provisions for 80mm rear plug-in modules and transition modules
- Optimum cooling using push/pull fans and with CoolSlot® air deflecting card guides
- Embedded 300W ATX power supply
- Easily customized with disk drive, power supplies, and various front panels
- Available with integrated CPU, peripherals and operating system pre-loaded and tested by Hybricon
® CompactPCI is a registered trademark of the PCI Industrial Computers Manufacturers Group
® CoolSlot is a registered trademark of Hybricon Corporation
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