Press Releases
Ruggedized COTS High Power Enclosures Cool Up to 125 Watts Per Slot
Ayer, MA., March 14, 2005, Hybricon Corporation announces the release of a new line of 10U rackmount high power enclosures (the RME1021M Series) which feature high quality ruggedized construction and a compact stackable design for vertically mounted cards. The RME1021 enclosures are designed to cool extremely dense CPU and DSP boards. Dual DC impellers powered by a dedicated power supply output provide 16.1 CFM per slot, sufficient cooling for 125 watts per slot.
The RME1021M enclosures are designed to meet MIL-STD-461 EMI radiated and conducted emissions and susceptibility standards as well as MIL-STD-810, MIL-S-901, and MIL-STD-167 environmental requirements (a commercial version, the RME821C series, is also available). Included are front and rear cover panels with honeycomb inlet and exhaust and provisions for shielded connectors for I/O. The enclosures are available with 21-slot CompactPCI®, VME64x, VME, or VXS backplanes and up to 2400 watts of embedded power. A closed loop fan speed control has programmable settings for minimum and maximum speeds and temperature break points.
Additional features include:
- Fully compatible with IEEE 1101.10/11 packaging standards
- Patented CoolSlot® air deflecting card guides improve airflow
- Mounting for two internal hard drives
- Thermal simulation of enclosure (thermal report available)
- Low smoke wire
- Honeycomb EMI air filters on front and rear panels
- Front panel LCD display with monitoring of voltages, fans, and temperature with RS-232, Ethernet, and SNPM support
® CompactPCI is a registered trademark of the PCI Industrial Computers Manufacturers Group
® CoolSlot is a registered trademark of Hybricon Corporation
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