Technical Papers

Hybricon's Technology Focus™ publications are a valuable resource, providing technical information related to Hybricon's core areas of expertise for the purpose of helping our customers make informed choices. The publications discuss new technologies such as switch fabrics, PICMG and VITA standards, trends in packaging solutions, thermal management, and backplane design. Also included in these publications is information related to the basic principles and fundamentals of theory, understanding applications, modeling and simulation methods for signal integrity, transmission of signals in backplanes, and airflow and cooling of equipment in enclosure design.

Switch Fabrics

	VXS and VPX REDI Pave Road to Next-Generation VME
	VITA Switch Fabric Roadmap
	VITA 41.x-VXS: Adding High Performance Switch Fabrics to VME Based Systems
	The Switch Fabrics are Coming, and They Have Already Arrived!
	VITA 31.1
	Introduction to the New PICMG 2.18 Serial RapidIO CompactPCI Specification
	PICMG 2.16 Switch Fabric Reference Card
	Introduction to the NEW PICMG® 2.17 StarFabric CompactPCI® Specification
	PICMG 2.17 Switch Fabric Reference Card
	Introduction to the NEW PICMG® 2.16 CompactPCI® Packet Switching Backplane Specification

Chassis Design

Tougher MicroTCA Tackles Applications Beyond Telecom

Ruggedizing MicroTCA: Going Beyond the Central Office

Using Mezzanine Card Assemblies: Power Dissipation and Airflow Evaluation

Rack Enclosure Level Packaging: Concerns and Considerations

8U Vertical VME/CompactPCI Chassis and The Pitfalls of Chassis Design

VITA 1.7: Powering Up VME64x Based Systems

Circuit Card P-Q Curves For Enclosure Design

Embedded Packaging Thermal Challenges

Thermal Management Process: Points of Understanding

Enclosure Design Guidance Planning for NEBS Compliance

Competitive Analysis: 9 Slot CompactPCI(r) Development Chassis

CoolSlot™ Card Guide Performance Measurements

Novel CoolSlot™ Card Guide Eliminates Hot Spots by Improving Air Flow Distribution

Thermal Evaluation Reports

	Advances in Thermal Management Techniques for Chassis Design, May 2008
	Flomerics Article, March 2007
	RME1021 Thermal Evaluation Report
	Cool-H Tower Thermal Simulation Report
	4U SRME Thermal Evaluation Report
	PRME Thermal Simulation Study
	RME1221 Thermal Simulation Study
	RME21 Thermal Simulation Study
	2U SRME Thermal Simulation Study

Bus Architectures

	Network Challenges Drive Form-Factor Choice
	VITA 1.5 2eSST
	CompactPCI Quick Reference Card
	Understanding the Relationship between the PICMG® 2.1 R 1.0 CompactPCI® Hot Swap Specification and the New Revision PICMG 2.0 R3.0 CompactPCI Specification
	Understanding the New Revision of the CompactPCI® Core Specification: PICMG 2.0 R3.0
	Understanding the New CompactPCI® Keying Specification: PICMG 2.10 R1.0

Backplane Design

	Designcon 2000 - 1.5~3 Gbps Differential Backplane Case Study
	Method for Noiseless Digital/Analog Interfacing In Complex Systems Using An Intermediate Ground Plane
	Backplane Design: A Theoretical Tutorial
	The Application of Modeling and Simulation Methods to Backplane System Design
	Electrical Characteristics, Simulations, and TDR Measurements of High Performance Backplanes
	AC Current Distribution in Conductors
	Hybricon VME Enhanced Six-Layer Backplane Performance Data

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