Services Overview
Engineered Solutions
Hybricon is an electronic packaging solutions provider. We provide a full range of design services required to support today’s most demanding applications.
Engineering technically superior products starts with our customer focused applications staff and design engineering staff. Whether it is an electronic enclosure, backplane, or subrack, Hybricon prides itself on providing our customrs with a quality product that exceeds their expectations.
Hybricon is a technology leader, offering the most advanced products in the industry. Today’s high performance systems require world class thermal capabilities and signal integrity capabilities. Whether you have 6U boards dissipating 200 Watts, or backplane signals running at 10 Gbps, Hybricon has already done it In applications ranging from air cooled to conduction cooled or liquid cooled, Hybricon is the vendor of choice for high power and high speed signaling.
Products Description
Our current line of standard products includes: Enclosures, Backplanes, Card Cage/Backplane Assemblies, Extender Cards, Power Supplies, and various Custom Designs in all of the previous product areas.
Our standard product platforms and building blocks allow us to rapidly tailor solutions for most applications. Many of our Custom Designs are total turnkey product solutions.
Services Description
Engineering is a core competency at Hybricon. We are technological leaders in the industry and offer our services to all of our customers. Our areas of expertise are in product packaging design/engineering. In addition to 3D mechanical design and backplane design, this includes Advanced Thermal Analysis and Structural Analysis as well as Advanced Signal Integrity Analysis capabilities.
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