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Signal Integrity Analysis Services

Today’s high performance systems require world class signal integrity capabilities.  Many of today’s standard switched fabric backplanes are operating at 2.5 Gps to 3.125 Gbps, with leading edge products operating at 6.25 Gps to 10 Gbps.  With 20 years of experience in signal integrity simulation, Hybricon has already done it.  In fact, Hybricon performed signal integrity simulation studies for standard groups in developing many of today’s standard backplanes.   In applications ranging from PICMG 2.16 to MicroTCA, VXS, VPX, or custom backplanes Hybricon is the vendor of choice for high speed backplane signaling.

3D Electromagnetic Field Modeling

The HSPICE models generated by the 2D and 3D electromagnetic (em) field solver programs are integrated with HSPICE models of transceivers and other components to obtain simulated waveforms of signal behavior under different conditions such as variable rise times and variable loading conditions. These 2 and 3D em models can be created for many circuit features such as vias (as shown), surface mount pads, etc. This capability allows us to include as much detail as is needed to accurately represent the high-speed designs that our customers need. This simulated data is interpreted and analyzed for design optimization to improve performance and reduce cost.


3D Differential Via Model Example

Simulated Eye Diagrams

Hybricon has also developed many HSPICE data post-processing routines. These routines can render simulated data into a form more useful for our customers design engineers. For example, when examining a high-speed communications system, engineers often look at what are known as 'eye-diagrams' (as shown to left). These eye-diagrams layer many bits over each other such that the channel's net ability to transmit data can be examined.


Simulated Eye Diagram Example

How Accurate Are The Signal Transmission Models?

At Hybricon, all models of each segment of the transmission system, including connectors, stubs, plated holes, component package leads, etc., are derived from complete planar and spatial electric and magnetic field distributions within and around the metal and dielectric media which make up the structures. The result is a signal transmission model with a very high degree of accuracy.

Hybricon has performed Signal Integrity Analysis for PICMG and VITA, in developing many new backplane standards. These include PICMG 2.16 (Ethernet switch fabric), PICMG 2.17 (StarFabric switch fabric), PICMG 2.18 (RapidIO switch fabric), and VITA 1.5 (VME 2eSST protocol).

A comparison of the simulated and measured crosstalk waveforms in an incident-wave VITA 1.5 protocol on a VME64x backplane are shown below. They clearly demonstrate the accuracy of the simulation.

Simulated Eye Diagram Example
Simulated Strong
 
Measured Waveform
 


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