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Custom Engineered Solutions

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The modularity of Pac-2000® technology means that customized enclosure solutions can be easily configured to meet customer needs. Enclosure systems are engineered to respond to our customers’ performance requirements including:

  • Signal integrity analysis
  • Thermal analysis
  • Structural analysis
  • Conformance to various industry and military standards
  • Qualification testing

Engineered Thermal solutions using a variety of cooling methods  (see Thermal Analysis section)

  • Free air convection cooling
  • Forced air convection cooling
  • Conduction cooling
  • Liquid cooling
  • Heat exchangers
  • Heat pipes
  • Hybrid approaches

Engineered Signal Integrity solutions (see Signal Integrity Analysis section)

  • Example: Chassis solution with 6.25 Gbps custom VXS backplane
  • Example: Chassis solution with 10 Gbps custom backplane

Hybricon’s custom engineered solutions provide best-in-class thermal performance:

  • Example: air cooled chassis solution: 200W/slot (6U x 160mm cPCI style cards)
  • Example: air cooled cabinet solution with 3 custom chassis in cabinet (chassis and rack level monitoring system: 16kW). One of the solutions for Homeland Security.
  • Example: liquid cooled ATR solution: 100W/slot with conduction cooled cards

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